Our company boasts a state-of-the-art optoelectronic hybrid integrated device packaging and testing center,occupying an area of over 700 square meters,with an internal Class 10,000 cleanroom spanning approximately 300 square meters. We possess advanced micrometer-level technology,enabling precise assembly and processing of optoelectronic hybrid devices,including bonding,eutectic welding,chip adhesion,coupling,and sealing processes.
Our laboratory is fully equipped to conduct comprehensive inspections,identification,testing,grading,and secure storage of quantum core devices and their related products,ensuring product quality. Additionally,we have two SMT production lines,two DIP production lines,and one three-proof coating production line,providing the capability to execute system-level surface mounting,through-hole soldering,three-proof coating,screening,complete machine assembly and debugging,testing,and verification,among other production tasks.
R&D,customization,best service,We provide one-stop solution with high quality products!
R&D Personnel
Authorized Patents
Testing and
Evaluation Center
Class 10,000
Cleanroom
Authorized Patents
We collaborate with the University of Science and Technology of China and upstream/downstream research institutions in the research of core components,conducting extended growth techniques based on III-V compound materials in the InGaAs production line. We also engage in research on wafer processing platforms and various flip-chip and testing platforms,possessing a complete set of capabilities including design,wafer fabrication,packaging,manufacturing,and quality control.
Our company houses a photonic-electronic hybrid integrated device packaging and testing center spanning over 700 square meters,with an enclosed cleanroom of approximately 300 square meters,meeting Class 10,000 cleanroom standards. Equipped with advanced micrometer-level technology,we excel in the precision assembly and processing of photonic-electronic hybrid devices,including processes such as bonding,eutectic soldering,chip bonding,coupling,and sealing.
Our company houses a photonic-electronic hybrid integrated device packaging and testing center spanning over 700 square meters, with an enclosed cleanroom of approximately 300 square meters, meeting Class 10,000 cleanroom standards. Equipped with advanced micrometer-level technology, we excel in the precision assembly and processing of photonic-electronic hybrid devices, including processes such as bonding, eutectic soldering, chip bonding, coupling, and sealing.
Our company's mission is to harness the power of photonics to drive innovation and create a brighter,sustainable future. Our vision is to lead the way in advancing cutting-edge optical technologies,empowering progress across industries,and shaping a world illuminated by endless possibilities.
13th Floor, D1#, Phase I, Gongtou Liheng Industrial Plaza, Fanhua Avenue, Feixi County Economic Development Zone, Hefei City, Anhui Province
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